The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Sep. 26, 2011
Frank J. Semcer, Sr., Far Hills, NJ (US);
Steven G. Santoro, Green Brook, NJ (US);
James Mcclintock, Greenville, SC (US);
Frank J. Jankoski, Jr., Alpha, NJ (US);
Frank J. Semcer, Sr., Far Hills, NJ (US);
Steven G. Santoro, Green Brook, NJ (US);
James McClintock, Greenville, SC (US);
Frank J. Jankoski, Jr., Alpha, NJ (US);
Micro Stamping Corporation, Somerset, NJ (US);
Abstract
A Ferritic stainless steel, non Ferritic stainless steel or carbon steel based lead frame and method for producing same is provided. The lead frame is preferably used for TantalumNiobium capacitors but could possibly be applicable to other integrated circuits with the same operating parameters. Any reference to Tantalum capacitors in this application applies equally to Niobium capacitors unless otherwise noted. The lead frame is prepared by choosing one of Ferritic stainless steel, non Ferritic stainless steel or carbon steel as a base metal and rolling it to a final required thickness. The base metal is then preferably plated with a nickel strike or other conventional barrier layer and then with final outer plating layers(s). The exact thickness and choice of layering varies and can be tailored to meet the requirements of each lead attach process.