Binghamton, NY, United States of America

Frank E Andros


Average Co-Inventor Count = 3.0

ph-index = 9

Forward Citations = 277(Granted Patents)


Location History:

  • Binghamton, NY (US) (1980 - 2000)
  • Binghampton, NY (US) (2001)

Company Filing History:


Years Active: 1980-2001

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10 patents (USPTO):Explore Patents

Title: The Innovations of Frank E. Andros

Introduction

Frank E. Andros is a notable inventor based in Binghamton, NY (US). He has made significant contributions to the field of electronics, holding a total of 10 patents. His work primarily focuses on enhancing electronic packaging and heat management solutions.

Latest Patents

One of his latest patents is titled "Structure for Removably Attaching a Heat Sink to Surface Mount Packages." This invention provides a method for securely attaching a heat sink to an electronic package, ensuring efficient thermal management. The design includes at least one heat sink engaging member that interacts with the heat sink and the electronic package. Additionally, it features retaining clips that help maintain the heat sink's position. Another significant patent is the "Method of Making an Electronic Package," which outlines a process for electrically bonding conductive leads to circuitized members. This method improves the alignment and bonding of leads, enhancing the reliability of electronic packages.

Career Highlights

Frank E. Andros is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the field of electronics. His work has contributed to advancements in electronic packaging technologies, making him a valuable asset to his team and the industry.

Collaborations

Throughout his career, Frank has collaborated with talented individuals such as James Russell Bupp and Michael DiPietro. These collaborations have fostered a creative environment that has led to the development of innovative solutions in electronics.

Conclusion

Frank E. Andros is a distinguished inventor whose work has significantly impacted the electronics industry. His patents reflect his commitment to innovation and excellence in electronic packaging.

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