International Business Machines Corporation

Frank E Andros

James Russell Bupp

Michael DiPietro

Richard B Hammer

Robert J Shay

Michael A Gaynes

David James Alcoe

Joseph Maryan Milewski

Hussain Shaukatullah

Christopher G Angulas

Reinhold E Tomek

Wayne R Storr

Ghazaros K Kerjilian

Bert E Stevens

A structure for removably attaching a heat sink to an electronic package. At least one heat sink engaging member engages a surface of the heat sink opposite a surface of the heat sink engaging the electronic package. At least two heat sink retaining clips extend from opposite sides of the at least one heat sink engaging member. Each retaining clip includes a first arm for extending past a side of the heat sink and a portion of the electronic package and a second arm extending from the first member for engaging the electronic package.

Structure for removably attaching a heat sink to surface mount packages

An electronic package is made by electrically bonding groups of conductive leads to two circuitized members after aligning the leads with electrical conductors on the circuitized members. Retention members may be used to hold the leads in alignment relative to each other prior to bonding and then are removed. Removal may include tearing away the retention member in propinquity to notches in the leads.

Method of making an electronic package

An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

Electronic package with thermally conductive support member having a

Method of making an electronic package with a thermally conductive

An electronic package and method of making same wherein a flexible circuitized substrate is used to interconnect contact sites on a semiconductor device (chip) to respective conductors on a circuitized substrate (PCB). Significantly, the flexible substrate is coupled to the PCB using solder elements which are applied to the flexible substrate prior to semiconductor device coupling to others of the flexible substrates' conductive elements. These other conductive elements are then connected to the devices' contact sites using thermocompression bonding, the bonding occurring through an aperture in the flexible substrate.

Electronic package structure and method of making same

A closed two phase liquid-vapor heat transfer device is provided which is independent of orientation and requires no wick. A micro helix containment vessel contains liquid to form a coolant vapor phase. Heat input at the evaporator section results in evaporation of the liquid at the liquid-vapor interface. The vapor flows through the bellow and condenses on the opposite end where heat is rejected and liquid is replenished to the evaporator section by flow through capillary passages of helical form in the corrugations of the bellows.

Micro helix thermo capsule

Metallized ceramic modules (MC), which are mounted on printed circuit cards, and multi-layer ceramic modules (MLC), which are mounted on a printed circuit planar board, are combined into one hybrid package. An air cooling distribution system is provided wherein air is first caused to impinge against the multi-layer ceramic modules after which it is directed to flow serially across the metallized ceramic modules.

Air-cooled hybrid electronic package

A closed two phase liquid-vapor heat transfer device is provided which is independent of orientation and requires no wick. A micro bellows containment vessel is filled with liquid to form a coolant vapor phase bubble which is centered within the vessel due to the surface energy characteristics of the fluid. Heat input at the evaporator section results in evaporation of the liquid at the liquid-vapor interface. The vapor flows across the bubble and condenses on the opposite side where heat is rejected and liquid is replenished to the evaporator section by flow through the continuous liquid film.

Growing community of inventors

Binghamton, NY, United States of America

Frank E Andros