Francois Arguin

Title: Innovations of Francois Arguin

Introduction

Francois Arguin is a notable inventor based in Bromont, Canada. He has made significant contributions to the field of technology, particularly in the area of chip interconnection systems. His innovative work has led to the development of a patented technology that enhances the efficiency of electronic devices.

Latest Patents

Francois Arguin holds a patent for a "High-density chip-to-chip interconnection with silicon bridge." This invention provides a package and system for high-density chip-to-chip interconnection. The technology utilizes a plurality of circuit dies, including a laminate substrate adjacent to these dies. It features a conductive spacer positioned between the laminate substrate and one of the circuit dies, along with a silicon bridge and a conductive interposer. The design also incorporates a top layer of a printed circuit board (PCB) coupled with a bottom layer of the laminate substrate. The conductive spacer can consist of laminate, organic, or copper material.

Career Highlights

Francois Arguin is associated with the International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop advanced technologies that push the boundaries of electronic interconnectivity.

Collaborations

Francois has collaborated with notable colleagues such as Luc Gilbert Guerin and Maryse Cournoyer. These partnerships have contributed to the advancement of his projects and the successful implementation of innovative solutions.

Conclusion

Francois Arguin's contributions to the field of technology through his patent and work at IBM highlight his role as a significant inventor. His innovations in chip interconnection systems are paving the way for more efficient electronic devices.