International Business Machines Corporation

Francois Arguin

Jean Audet

Luc Gilbert Guerin

Richard D Langlois

Maryse Cournoyer

Pascale Gagnon

Christian Bergeron

Steve E Whitehead

Nathalie Meunier

A package and system for high-density chip-to-chip interconnection is provided. Embodiments of the present invention utilizes a plurality of circuit dies including a laminate substrate adjacent to the plurality of circuit dies. It also includes a conductive spacer disposed between the laminate substrate and one of the plurality of circuit dies, a silicon bridge and a conductive interposer disposed between the laminate substrate and the plurality of dies and adjacent to the conductive spacer. Furthermore the embodiment of this present invention can include a top layer of a printed circuit board (PCB) coupled with a bottom layer of the laminate substrate. The conductive spacer comprises, at least of, a laminate, organic or copper material.

High-density chip-to-chip interconnection with silicon bridge

Growing community of inventors

Bromont, Canada

Francois Arguin