Francis F Cappo

Title: Inventor Spotlight: Francis F Cappo from Wappingers Falls, NY

Introduction

Francis F Cappo is a noted inventor based in Wappingers Falls, NY, with a remarkable three patents to his name. His contributions to the field of electronic component design have paved the way for innovations that enhance the efficiency and reliability of electronic devices.

Latest Patents

Cappo's latest patents include an "Electronic Component Package with Decoupling Capacitors Completely." This invention details a unique substrate design featuring a die-receiving cavity that allows for the effective placement of capacitors entirely within the cavity, promoting improved functionality.

Another significant patent by Cappo is titled "Interconnection Structure and Test Method." This innovation describes a connector structure that includes solder portions on a substrate, designed to facilitate reliable connections in electronic assemblies. It outlines a testing method to evaluate the solderability of these structures, ensuring high-quality performance in electronic applications.

Career Highlights

Cappo has made significant strides in his career as an inventor while working at the esteemed International Business Machines Corporation (IBM). His work has notably impacted electronic component engineering, where his inventive solutions have been recognized in the industry.

Collaborations

Throughout his career, Cappo has collaborated with notable colleagues, including John R Behun and Anson Jay Call. Together, they have worked on groundbreaking projects that have advanced technology in electronic design and manufacturing.

Conclusion

Francis F Cappo's innovative spirit and dedication to the field have made him a valuable asset to IBM and the broader engineering community. His patents reflect a commitment to improving electronic component design, showcasing how individual inventors contribute to technological advancements that shape our modern world.