International Business Machines Corporation

Francis F Cappo

Anson Jay Call

Marie S Cole

Karl G Hoebener

John R Behun

John C Milliken

Bruno T Klingel

Sarah Huffsmith Knickerbocker

Peter Jeffrey Brofman

Jason Lee Frankel

Suresh D Kadakia

Kenneth A Bird

Scott A Sikorski

An electronic component package comprising a substrate having at least one die-receiving cavity formed therein, the cavity being defined by a die-receiving surface and an inner sidewall having a terraced contour, the substrate having an exterior surface bordering the cavity perimeter, the inner sidewall extending between the die-receiving surface and the substrate exterior surface, and at least one capacitor positioned completely within the cavity and mounted to the terraced contour of the inner sidewall.

Electronic component package with decoupling capacitors completely

Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.

Interconnection structure and test method

Growing community of inventors

Wappingers Falls, NY, United States of America

Francis F Cappo