Fong-Jie Du

Title: Fong-Jie Du: Innovator in Substrate Processing Technology

Introduction

Fong-Jie Du is a distinguished inventor based in Tokyo, Japan, recognized for his innovative contributions to substrate processing technology. With a portfolio of four patents, Du's work focuses on the automation and efficiency of substrate handling, significantly impacting the field.

Latest Patents

Fong-Jie Du's latest patents include two notable inventions: the "Substrate Transporter and Substrate Processing Apparatus Including Substrate Transporter" and the "Polishing Head and Polishing Apparatus." The substrate transporter invention provides an automated apparatus for conveying rectangular substrates, featuring a sophisticated design of conveyance rollers, roller shafts, and a motor. This design enhances the efficiency of substrate handling by utilizing a pusher mechanism to separate the substrate from the rollers during operation.

The polishing head patent emphasizes a compact and efficient construction, highlighting a pressing member, a movable shaft, and a diaphragm that forms a pressure chamber. This innovative design ensures optimal polishing tool support while maintaining simplicity and compactness.

Career Highlights

Fong-Jie Du has dedicated his career to advancing substrate processing technologies while working for Ebara Corporation. Throughout his tenure, he has focused on creating efficient and automated devices that streamline substrate handling processes in various applications.

Collaborations

In his pursuit of innovation, Du has collaborated with notable colleagues, including Makoto Kashiwagi and Yu Ishii. Their collective efforts contribute to Ebara Corporation's reputation as a leader in the industry, fostering a culture of creativity and technical excellence.

Conclusion

Fong-Jie Du's inventive spirit and dedication to substrate processing technology exemplify the impact that innovation can have on the industry. Through his patents and collaborations, he continues to drive advancements that enhance operational efficiency, influencing the future of substrate handling and processing applications.