Company Filing History:
Years Active: 2023-2025
Title: Innovations of Florian Herrault in Electronic Assembly
Introduction
Florian Herrault is a prominent inventor based in Agoura Hills, California. He has made significant contributions to the field of electronic assembly, holding a total of nine patents. His work focuses on the integration of radio frequency transistor chiplets and innovative chip bonding techniques.
Latest Patents
Florian's latest patents include groundbreaking technologies such as the "Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuits." This invention involves an electronic assembly with a host wafer that includes passive devices for tuning or matching networks. The design allows for chiplets to be placed in cavities, with at least one chiplet featuring a second circuit that includes a transistor or switch device along with passive tuning circuits.
Another notable patent is "Chip integration into cavities of a host wafer using lateral dielectric material bonding." This electronic assembly features a backside capping layer and a host wafer bonded to it, with cavities formed over specific areas. The chiplets are bonded directly to the capping layer, utilizing lateral dielectric material to create a strong bond between the chiplets and the wafer.
Career Highlights
Florian Herrault has established himself as a key figure in his field through his innovative patents and contributions to electronic assembly technology. His work has paved the way for advancements in the integration of electronic components, enhancing performance and efficiency.
Collaborations
Florian collaborates with notable professionals in the industry, including Daniel Somerset Green and James F. Buckwalter. Their combined expertise contributes to the development of cutting-edge technologies in electronic assembly.
Conclusion
Florian Herrault's contributions to electronic assembly through his patents demonstrate his innovative spirit and commitment to advancing technology. His work continues to influence the field and inspire future developments in electronic integration.
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