Company Filing History:
Years Active: 2001-2009
Title: Innovations of Ferdinand Borromeo Arabe
Introduction
Ferdinand Borromeo Arabe is a notable inventor based in Baguio, Philippines. He has made significant contributions to the field of technology, particularly in the area of semiconductor packaging. With a total of 6 patents to his name, Arabe continues to push the boundaries of innovation.
Latest Patents
One of his latest patents focuses on a patterned plasma treatment to improve the distribution of underfill material. This innovative approach enhances the distribution of underfill material between the chip and the substrate. The underfill material is typically dispensed after the chip is electrically connected to the substrate. The connection is often made using an array of solder bumps. The underfill material is drawn into the gap between the chip and the substrate through capillary action. The patterned plasma-treated area on the chip or substrate generates greater capillary force on the underfill material compared to non-plasma-treated areas. This design allows for better control of underfill distribution while forming a chip package.
Career Highlights
Ferdinand Arabe is currently employed at Texas Instruments Corporation, where he applies his expertise in semiconductor technology. His work has contributed to advancements in the efficiency and reliability of electronic devices.
Collaborations
Throughout his career, Arabe has collaborated with esteemed colleagues such as Charles Anthony Odegard and Mohammad Yunus. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Ferdinand Borromeo Arabe is a distinguished inventor whose work in semiconductor technology has led to significant advancements in the field. His innovative approaches, particularly in underfill material distribution, showcase his commitment to enhancing electronic device performance.