Texas Instruments Corporation

Ferdinand Borromeo Arabe

Mohammad Yunus

Charles Anthony Odegard

Arthur Bayot

Ronaldo Marasigan Arguelles

Teddy D Weygan

Ma Celine R Mandapat

Paul Gabriel D Perez

Alvin O Soria

A patterned plasma treatment may be provided on the chip and/or the substrate to enhance the distribution of underfill material between the chip and the substrate. The underfill material is typically dispensed after the chip is electrically connected to the substrate. The chip may be electrically connected to the substrate by an array of solder bumps, as one example. The underfill material is draw into a gap between the chip and the substrate by a capillary action. The patterned plasma-treated area formed on the chip and/or on the substrate may cause greater capillary force on the underfill material, as compared to non-plasma-treated areas. Such patterned plasma-treatment area may be designed and laid out to provide for more or better control of the underfill distribution between the chip and substrate while forming a chip package.

Patterned plasma treatment to improve distribution of underfill material

A method of manufacturing a ball grid array semiconductor package includes the step of providing a substrate ( ) having a first surface ( ) and a second surface ( ), in which the first surface ( ) or the second surface ( ) include a conductor pattern ( ). The method also includes the step of disposing a plurality of conductive bumps ( ) on the first surface ( ) of the substrate ( ) and attaching a semiconductor die ( ) to the second surface ( ) of the substrate ( ). The method further includes the step of electrically connecting the conductive bumps ( ) to the conductor pattern ( ), such that electrically connecting the conductive bumps ( ) to the conductor pattern ( ) mechanically affixes the conductive bumps ( ) to the first surface ( ) of the substrate ( ). The method also includes the steps of mechanically testing the ball grid array semiconductor package ( ) to determine whether a height of the conductive bumps ( ) are substantially uniform, and planarizing the conductive bumps ( ) when the height of the conductive bumps are non-uniform.

Methods of and apparatus for manufacturing ball grid array semiconductor device packages

A micro-BGA style package for semiconductor device comprises a semiconductor chip and a package substrate. The semiconductor chip includes a plurality of conductive pads. A plurality of transistor circuits are formed upon the semiconductor chip. The package substrate has first and second sides. A plurality of conductive terminals are formed on the first side of the package substrate. At least one of the terminals is electrically coupled to at least one of the conductive pads. A plurality of contacts are formed on the second side of the package substrate. A plurality of traces are disposed on the first side of the package substrate. Each trace provides at least part of an electrical coupling between at least one of the terminals and at least one of the contacts. The traces are formed from a copper based metal having a tensile strength of more than about 60 kg per mm .

Ball grid array substrate with improved traces formed from copper based metal

Methods and apparatus for manufacturing ball grid array semiconductor device packages

A substrate for solder ball assembling a semiconductor device substantially parallel onto said substrate, said device having a plurality of terminals arrayed on a warped surface, comprising an electrically insulating surface including a plurality of discrete metallic areas; said areas having locations matching the locations of said device terminals, and further being suitable for solder ball attachment in surface mount reflow operation; and said areas further having at least one characteristic suitable for accommodating said device warping in solder reflow operation, whereby areas having higher amounts of said characteristic cause said solder balls to become thinner during reflow, resulting in lower solder joint heights, relative to the heights of the remaining solder joints.

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Baguio, Philippines

Ferdinand Borromeo Arabe