The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
Jul. 26, 2002
Arthur Allan Bayot, Baguio, PH;
Ferdinand B. Arabe, Baguio, PH;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method of manufacturing a ball grid array semiconductor package includes the step of providing a substrate ( ) having a first surface ( ) and a second surface ( ), in which the first surface ( ) or the second surface ( ) include a conductor pattern ( ). The method also includes the step of disposing a plurality of conductive bumps ( ) on the first surface ( ) of the substrate ( ) and attaching a semiconductor die ( ) to the second surface ( ) of the substrate ( ). The method further includes the step of electrically connecting the conductive bumps ( ) to the conductor pattern ( ), such that electrically connecting the conductive bumps ( ) to the conductor pattern ( ) mechanically affixes the conductive bumps ( ) to the first surface ( ) of the substrate ( ). The method also includes the steps of mechanically testing the ball grid array semiconductor package ( ) to determine whether a height of the conductive bumps ( ) are substantially uniform, and planarizing the conductive bumps ( ) when the height of the conductive bumps are non-uniform.