Suzhou, China

Fengming Lin

This inventor holds 2 USPTO granted patents. Top assignee: Innoscience (Suzhou) Technology Co., Ltd.. Active years: 2024-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fengming Lin. Retrieved from https://idiyas.com/inventor/fengming-lin-cscv30so

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2024-2025

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2 patents (USPTO):Explore Patents

Title: Innovations by Fengming Lin in Semiconductor Technology

Introduction

Fengming Lin is a notable inventor based in Suzhou, China, recognized for his contributions to semiconductor technology. He holds two patents that showcase his expertise in manufacturing semiconductor devices. His work has significant implications for the advancement of electronic components.

Latest Patents

Fengming Lin's latest patents include a method for manufacturing a semiconductor device. This method involves several steps, starting with the formation of a first nitride-based semiconductor layer over a substrate. A second nitride-based semiconductor layer is then formed on the first layer. Following this, a gate electrode is created over the second layer, and a first passivation layer is applied to cover the gate electrode. A first blanket field plate is formed on this passivation layer and is patterned to create a first field plate above the gate electrode using a wet etching process. A second passivation layer is then formed to cover the first field plate, followed by the creation of a second blanket field plate, which is patterned using a dry etching process.

Additionally, his patent describes a semiconductor device that includes a gate electrode, first and second passivation layers, and first and second field plates. The gate electrode is positioned above the nitride-based semiconductor layers, with the first passivation layer covering it. The first field plate is located on the first passivation layer, which has portions both covered and uncovered by the field plate. The second passivation layer covers the first field plate, with the second field plate positioned above it, also having portions covered and uncovered. Notably, the thickness difference between the first and second portions of the first passivation layer is less than that of the second passivation layer.

Career Highlights

Fengming Lin is currently employed at Innoscience Technology Co., Ltd., where he continues to innovate in the field of semiconductor manufacturing. His work is pivotal in enhancing the efficiency and performance of semiconductor devices.

Collaborations

Fengming collaborates with talented coworkers, including Qiyue Zhao and Wuhao Gao, who contribute to the innovative environment at Innoscience Technology Co., Ltd.

Conclusion

Fengming Lin's contributions to semiconductor technology through his patents and work at Innoscience Technology Co., Ltd. highlight his role as a significant inventor in the field. His innovative methods and devices are set to influence the future of

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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