Hong Kong, China

Fengbin Tu

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Ai Chip Center for Emerging Smart Systems Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fengbin Tu. Retrieved from https://idiyas.com/inventor/fengbin-tu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations by Fengbin Tu in Integrated Memory-Compute Circuit Design

Introduction

Fengbin Tu is an inventor based in Hong Kong, CN. He has made significant contributions to the field of integrated memory-compute circuit design. His innovative approach focuses on automatic compilation methods that enhance the efficiency of circuit layout generation.

Latest Patent Applications

Fengbin Tu's notable patent application is titled "AUTOMATIC COMPILATION METHOD AND FRAMEWORK FOR GENERATING A LAYOUT OF INTEGRATED MEMORY-COMPUTE CIRCUIT." This application presents an automatic compilation method that includes constructing a design database with a basic design library and referencing architecture templates. The method involves receiving user specifications, selecting and parameterizing architecture templates, generating physical layouts, and optimizing these layouts through iterative design exploration. The goal is to evaluate hardware metrics to determine the optimal physical layout for integrated memory-compute circuits.

Conclusion

Fengbin Tu's work represents a significant advancement in the design of integrated memory-compute circuits, showcasing innovative methods that could lead to more efficient circuit designs in the future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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