Feng-Tao Lee

Title: Innovations of Feng-Tao Lee in Wafer Processing Technology

Introduction

Feng-Tao Lee is a notable inventor based in Miaoli County, Taiwan. He has made significant contributions to the field of wafer processing technology. With a focus on enhancing the efficiency and effectiveness of wafer processing, his work has implications for the semiconductor industry.

Latest Patents

Feng-Tao Lee holds a patent for an "Apparatus for Wafer Processing." This innovative apparatus includes a wafer pedestal designed to support a wafer, a radiation source that provides electromagnetic radiation to the wafer, and a transparent window positioned between the wafer pedestal and the radiation source. The transparent window features a first zone with a rough surface, characterized by an Ra value ranging from approximately 0.5 μm to approximately 100 μm. Additionally, the apparatus incorporates a primary reflector within the radiation source and a secondary reflector located between the transparent window and the radiation source. The rough surface can be applied to the transparent window, the primary reflector, and/or the secondary reflector.

Career Highlights

Feng-Tao Lee is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading entity in the semiconductor manufacturing sector. His work at this prestigious company allows him to collaborate with other talented professionals in the field.

Collaborations

Among his coworkers are Tung-Ching Tseng and Sung-Po Yang, who contribute to the innovative environment at Taiwan Semiconductor Manufacturing Company Ltd. Their collective expertise enhances the development of advanced technologies in wafer processing.

Conclusion

Feng-Tao Lee's contributions to wafer processing technology exemplify the innovative spirit within the semiconductor industry. His patent and collaborative efforts reflect a commitment to advancing technology in this critical field.