This inventor holds 2 USPTO granted patents. Top assignee: Nan Ya Technology Corporation. Active years: 2005-2006.
Location History:
- Taipei, TW (2005)
- Kaohsiung, TW (2006)
Company Filing History:
Years Active: 2005-2006
Title: Innovations by Feng-Chuan Lin
Introduction
Feng-Chuan Lin is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving manufacturing processes and device structures in the semiconductor industry.
Latest Patents
Feng-Chuan Lin's latest patents include a method for pre-retaining CB opening in a DRAM manufacturing process. This method involves filing a CB opening with a photo-resist layer and an LPD oxidation layer at room temperature, which helps avoid damage caused by conventional etching techniques. Additionally, he has developed a semiconductor device that features a trench top isolation layer. This method includes forming a collar insulating layer over the sidewall of a trench, creating a first conductive layer that protrudes from the collar insulating layer, and forming a second conductive layer that covers the collar insulating layer. The process also involves creating an insulating spacer and thermally oxidizing the second conductive layer to form an oxide layer.
Career Highlights
Feng-Chuan Lin is currently employed at Nan Ya Technology Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing manufacturing techniques and enhancing device performance.
Collaborations
Feng-Chuan Lin has collaborated with notable colleagues, including Jeng-Ping Lin and Tieh-Chiang Wu, contributing to various projects and innovations in the semiconductor field.
Conclusion
Feng-Chuan Lin's contributions to semiconductor technology through his patents and work at Nan Ya Technology Corporation highlight his role as a significant inventor in the industry. His innovative methods and collaborative efforts continue to shape advancements in semiconductor manufacturing processes.