Fei Ying Wong

Title: Fei Ying Wong: Innovator in Semiconductor Technology

Introduction

Fei Ying Wong is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His innovative work has paved the way for advancements in packaged semiconductor devices.

Latest Patents

Wong's latest patents include a groundbreaking design for a packaged semiconductor device with interior polygonal pads. This invention features a semiconductor chip and a package structure that defines a rectangular boundary. The bottom surface of the package structure includes interior polygonal pads that are strategically exposed and located on the centerline. Additionally, edge polygonal pads are positioned at the corners of the rectangular boundary. The design ensures that a line running between at least one vertex of each interior polygonal pad is parallel to an edge of the package structure's boundary, enhancing the device's functionality.

Career Highlights

Throughout his career, Fei Ying Wong has worked with prominent companies in the semiconductor industry, including NXP B.V. and Nexperia B.V. His experience in these organizations has contributed to his expertise and innovative capabilities in semiconductor technology.

Collaborations

Wong has collaborated with notable professionals in the field, including Roelf A J Groenhuis and Kan Wae Lam. These collaborations have further enriched his work and contributed to the development of advanced semiconductor solutions.

Conclusion

Fei Ying Wong's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His innovative designs continue to impact the industry positively.