Dalian, China

Fei Li

This inventor holds 1 USPTO granted patent. Top assignee: Rockwell Automation Technologies Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fei Li. Retrieved from https://idiyas.com/inventor/fei-li-he5p4w62

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Fei Li: Innovator in Industrial Robotics

Introduction

Fei Li is a prominent inventor based in Dalian, China. He has made significant contributions to the field of industrial robotics, particularly through his innovative patent that enhances the interaction between robots and industrial machines.

Latest Patents

Fei Li holds a patent titled "Systems and methods for controlling an on-premises robot through an industrial digital twin." This patent describes a method that includes a twin model management system presenting a video stream captured by a robot in an industrial facility. The video stream is displayed in a digital twin of the industrial facility to a user. The system allows users to select input devices of an industrial machine through the digital twin, facilitating seamless interaction between the robot and the machine.

Career Highlights

Fei Li is currently employed at Rockwell Automation Technologies Incorporated, where he continues to develop innovative solutions in the field of robotics. His work focuses on integrating advanced technologies to improve operational efficiency in industrial settings.

Collaborations

Fei Li collaborates with talented individuals such as Xin Liu and Mengqi Ma, contributing to a dynamic team that drives innovation in their projects.

Conclusion

Fei Li's contributions to industrial robotics through his patent and work at Rockwell Automation Technologies Incorporated highlight his role as a key innovator in the field. His efforts continue to shape the future of robotics in industrial applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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