This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Stmicroelectronics S.r.l.. Active years: 2018.
Company Filing History:
Years Active: 2018
Title: Federico Frego: Innovator in Bonding Pad Structures
Introduction
Federico Frego is a notable inventor based in Milan, Italy. He has made significant contributions to the field of semiconductor technology, particularly in the design of bonding pad structures. His innovative work has led to the development of a patent that enhances the performance and reliability of electronic devices.
Latest Patents
Federico Frego holds a patent for a bonding pad structure over active circuitry. This invention is designed to handle increased bonding loads effectively. The patent describes various embodiments that include a continuous metal layer, a first discontinuous metal layer, a second discontinuous metal layer, and dielectric material. The first and second discontinuous metal layers each feature a plurality of holes arranged in a specific pattern. Notably, the holes of the first layer overlap with those of the second layer, while the dielectric material fills the holes, enhancing the structural integrity of the bonding pad.
Career Highlights
Federico Frego is currently employed at STMicroelectronics S.r.l., a leading company in the semiconductor industry. His work at STMicroelectronics has allowed him to collaborate with other talented professionals and contribute to cutting-edge technology in electronics.
Collaborations
Some of his coworkers include Dario Vitello and Salvatore Latino. Their collaboration has fostered an environment of innovation and creativity, leading to advancements in semiconductor technology.
Conclusion
Federico Frego's contributions to bonding pad structures exemplify his commitment to innovation in the semiconductor field. His patent reflects a significant advancement that can improve the performance of electronic devices.