The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Apr. 28, 2016
Stmicroelectronics S.r.l., Agrate Brianza, IT;
STMICROELECTRONICS S.R.L., Agrate Brianza, IT;
Abstract
Various embodiments provide a bonding pad structure that is capable of handling increased bonding loads. In one embodiment, the bonding pad structure includes a continuous metal layer, a first discontinuous metal layer, a second discontinuous metal layer, and dielectric material. The first discontinuous metal layer and the second discontinuous metal layer each include a plurality of holes that are arranged in a pattern. The plurality of holes of the first discontinuous metal layer overlaps at least two of the plurality of holes of the second discontinuous metal layer. The dielectric material is formed between the metal layers and fills the plurality of holes of the first and second discontinuous metal layers.