This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Nxp B.v.. Active years: 2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013
Title: Fatha Khalsa: Semiconductor Chip-System Inventor
Introduction
Fatha Khalsa is an inventor based in San Jose, California, whose patent work addresses the design and packaging of high-bandwidth semiconductor systems. He is associated with NXP B.V. and is credited with 1 patent.
Latest Patents
Khalsa’s patent, “Impedance Optimized Chip System,” describes dividing a high-bandwidth circuit into portions for implementation on separate semiconductor chips. The method generates die bond-pad arrangements and chip locations in relation to package parameters and the package’s input/output arrangement. It aims to establish bond-wire lengths that meet specified characteristic-impedance requirements. The patent also describes boundary parameters for segmentation, including limits on the number of portions and, optionally, chip area.
Career Highlights
Khalsa’s documented patent contribution focuses on coordinating circuit segmentation, chip placement, and bond-wire design. These considerations are relevant to developing semiconductor packages that meet electrical and physical design constraints.
Collaborations
Khalsa’s listed coworkers include Dominicus M. Roozeboom and James Raymond Spehar. His company affiliation is NXP B.V.
Conclusion
Fatha Khalsa’s patent highlights an approach to optimizing semiconductor chip systems by aligning circuit segmentation and package layout with impedance requirements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile