Taufkirchen, Germany

Farhad Farassat

This inventor holds 17 USPTO granted patents and 1 published patent application, primarily in Wire Bonding Technology. Top assignees: F&k Delvotec Bondtechnik Gmbh, Emhart Inc., F & K Delvotec Bondtechnick Gmbh. Active years: 1992-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Farhad Farassat. Retrieved from https://idiyas.com/inventor/farhad-farassat

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 17 

% Patents Active = 76.5

Average Co-Inventor Count = 1.0

ph-index = 6

Forward Citations = 88(Granted Patents)


Company Filing History:


Years Active: 1992-2010

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Areas of Expertise:
Wire Bonding
Bonded Connections
Ultrasonic Bonding
Quality Testing
Hybrid Chip-Bonding
Pull Test
Bonding Tool
Chip-Transferring Station
Wire Guide
Wire Deformation
Monitoring Device
Cutting Device
17 patents (USPTO):Explore Patents

Title: The Innovative Journey of Farhad Farassat

Introduction

Farhad Farassat is a notable inventor based in Taufkirchen, Germany. With a remarkable portfolio boasting 17 patents, his contributions to the field of bonding technologies have significantly advanced the industry. His latest innovations demonstrate a profound understanding of complex engineering processes.

Latest Patents

Among his recent patents, Farassat has developed a "Method of Testing Bonded Connections," specifically aimed at improving the reliability of wire-bond connections. This method involves utilizing a bonding head equipped with a bonding tool and a wire clamp that operates under pressure and the influence of ultrasound or heat. Once the bonded connection is established, the bonding head is raised slightly away from the bonding site while securely gripping the bonding wire. During this movement, the tensile force acting on the wire is measured, providing critical data on the connection's integrity.

Additionally, his patent titled "Wire Bonder and Method of Operating the Same" introduces a sophisticated wire bonder. This device features a bonding head complete with a bonding tool and bonding wire guide, along with a cutting device that separates the excess bonding wire extending beyond the bonding point. The inclusion of a camera paired with an image processing unit allows for real-time monitoring and assessment of the working region, enhancing productivity and accuracy.

Career Highlights

Farhad has made significant contributions while working with renowned companies such as F&K Delvotec Bondtechnik GmbH. His expertise in bonding technology has established him as a leading figure in the development of advanced manufacturing processes within the industry.

Collaborations

His collaborations with key companies have bolstered his innovative endeavors, providing him with the resources and platform to bring his inventions to fruition. Working alongside esteemed organizations has allowed Farassat to refine his techniques and share knowledge that drives the industry forward.

Conclusion

Farhad Farassat's journey as an inventor showcases his dedication to innovation and improvement in bonding technologies. With 17 patents to his name, his work continues to influence the field, offering solutions that enhance the reliability and effectiveness of wire-bond connections. As he progresses in his career, the impact of his inventions will undoubtedly resonate within the engineering community.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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