The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 1995
Filed:
Dec. 10, 1993
Farhad Farassat, Taufkirchen, DE;
Abstract
A bonding head for an ultrasonic bonding machine comprises a wedge operatively associated with an ultrasound transducer by means of which an electrically conducting wire can be pressed against a contact surface of an electrical or electronic component and bonded thereto by ultrasonic excitation of the wedge. A wire clamp is located adjacent to and ahead of the wedge and can be moved back and forth by drive means in the direction of the wire being fed to the wedge. The wedge can be moved up and down together with the wire clamp and its drive means in a direction substnatially perpendicular to the contact surface. The bonding head as a whole is also disposed so that it can be swung about an axis perpendicular to the contact surface. The drive means for wire clamp comprises a translational drive which can move the wire clamp exactly parallel to the direction of the wire being fed to the wedge.