This inventor holds 1 USPTO granted patent. Top assignee: Shanghai Meadville Science & Technology Co., Ltd.. Active years: 2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2012
Title: Innovations by FanXiong Cheng in Printed Circuit Board Technology.
Introduction
FanXiong Cheng is a notable inventor based in Shanghai, China. He has made significant contributions to the field of printed circuit board technology. His innovative methods have paved the way for advancements in integrated circuit packaging.
Latest Patents
Cheng holds a patent for "Methods of preparing printed circuit boards and packaging substrates of integrated circuit." This patent describes a method of forming printed circuit boards and packaging substrates. The process involves creating blind vias in a dielectric layer, applying a first seed layer, and filling the vias with copper. The method further includes the formation of a wire pattern using a photo-sensitive thin film, leading to the creation of conductive patterns.
Career Highlights
FanXiong Cheng is associated with Shanghai Meadville Science & Technology Co., Ltd. His work at this company has been instrumental in developing innovative solutions for electronic manufacturing. Cheng's expertise in circuit board technology has garnered attention in the industry.
Collaborations
Cheng has collaborated with notable colleagues such as Peifeng Chen and Haitao Fu. Their combined efforts have contributed to the advancement of technology in their field.
Conclusion
FanXiong Cheng's contributions to printed circuit board technology exemplify the spirit of innovation. His patent and work at Shanghai Meadville Science & Technology Co., Ltd. highlight his role as a key figure in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile