The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2012
Filed:
Mar. 25, 2008
Fanxiong Cheng, Shanghai, CN;
Peifeng Chen, Shanghai, CN;
Haitao Fu, Shanghai, CN;
Yonghong Luo, Shanghai, CN;
FanXiong Cheng, Shanghai, CN;
Peifeng Chen, Shanghai, CN;
Haitao Fu, Shanghai, CN;
Yonghong Luo, Shanghai, CN;
Abstract
A method of forming printed circuit boards and packaging substrates. After blind vias are created in a dielectric layer, a first seed layer is provided in the vias and on the dielectric layer. Copper is applied to fill the vias and to form a copper layer over the vias and over the first seed layer. The first seed layer and the copper layer are removed and a second seed layer is formed on the dielectric layer and the exposed surfaces of the vias. A wire pattern is then formed using a photo-sensitive thin film applied to the second seed layer, and the wires in the wire pattern are thickened. The photo-sensitive thin film and the exposed portions of the second seed layer are removed to form a first conductive pattern of wires. The process may be repeated to form a second conductive pattern of wires on the first pattern.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile