This inventor holds 1 USPTO granted patent. Top assignee: Grace Semiconductor Manufacturing Corporation. Active years: 2008.
Company Filing History:
Years Active: 2008
Title: The Innovative Contributions of Fan-Chi Tseng
Introduction
Fan-Chi Tseng is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology. His work focuses on improving the structural integrity of semiconductor wafers, which is crucial for the advancement of electronic devices.
Latest Patents
Fan-Chi Tseng holds a patent for a "Structure and method of forming a semiconductor material wafer." This invention involves a detailed process of creating a semiconductor material wafer by forming an ingot of semiconductor material. The process includes the formation of a first dielectric layer on the ingot's surface, which is larger than the ingot itself. A second dielectric layer is then added, also larger than the first. The resulting semiconductor wafer structure features a slip core made of semiconductor material, along with two annular portions designed to protect the wafer and prevent edge cracks.
Career Highlights
Fan-Chi Tseng is currently associated with Grace Semiconductor Manufacturing Corporation. His role at the company allows him to apply his innovative ideas in a practical setting, contributing to the development of advanced semiconductor technologies.
Conclusion
Fan-Chi Tseng's work exemplifies the importance of innovation in the semiconductor industry. His patent addresses critical challenges in wafer production, showcasing his commitment to enhancing technology. His contributions are vital for the ongoing evolution of electronic devices.