Rennes, France

Fabien Danieau

USPTO Granted Patents = 16 

 

Average Co-Inventor Count = 3.9

ph-index = 1

Forward Citations = 5(Granted Patents)


Location History:

  • Cesson-sevigne, FR (2020 - 2021)
  • Rennes, FR (2017 - 2024)

Company Filing History:


Years Active: 2017-2025

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16 patents (USPTO):Explore Patents

Title: Fabien Danieau: Innovator in 3D Technology

Introduction

Fabien Danieau is a prominent inventor based in Rennes, France. He has made significant contributions to the field of 3D technology, holding a total of 16 patents. His work focuses on innovative methods and apparatuses that enhance the generation and representation of 3D models.

Latest Patents

Among his latest patents is a method and an apparatus for generating a 3D face comprising at least one deformed region. This invention involves obtaining a curvature exaggeration face from at least one region of a first 3D face, along with a proportion exaggeration deformation for that region. The combination of these elements allows for the creation of a deformed region in the 3D face. Another notable patent is the haptic scene representation format, which includes a haptic rendering device and method that enables the rendering of haptic effects described by metadata. This metadata contains information about a geometric model and the application of haptic feedback, along with a file format for carrying the required information.

Career Highlights

Fabien Danieau has worked with several notable companies throughout his career, including Thomson Licensing and InterDigital Ce Patent Holdings. His experience in these organizations has contributed to his expertise in the field of 3D technology and patent development.

Collaborations

He has collaborated with talented individuals such as Julien Fleureau and Philippe Guillotel, further enhancing his innovative projects and contributions to the industry.

Conclusion

Fabien Danieau's work in 3D technology and his impressive portfolio of patents highlight his role as a leading inventor in this field. His contributions continue to influence advancements in 3D modeling and haptic technology.

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