Karlsruhe, Germany

Fabian Niesler


 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2018

Loading Chart...
Loading Chart...
1 patent (USPTO):Explore Patents

Title: Fabian Niesler: Innovator in Three-Dimensional Structure Production

Introduction

Fabian Niesler is a prominent inventor based in Karlsruhe, Germany. He is known for his innovative contributions to the field of three-dimensional structure production. His work focuses on methods that enhance the capabilities of lithographic materials.

Latest Patents

Niesler holds a patent for a "Method for producing a three-dimensional structure." This method involves the polymerization of a shell wall of a three-dimensional structure using energy input methods. Initially, a polymerized shell wall is formed to enclose a volume of unpolymerized lithographic material. The surrounding lithographic material is then removed in an intermediate development step, followed by the polymerization of the enclosed volume using a second energy input method. This innovative approach has significant implications for the production of complex three-dimensional structures.

Career Highlights

Fabian Niesler is associated with Nanoscribe GmbH, a company that specializes in advanced lithography technologies. His work at Nanoscribe has positioned him as a key player in the field of microfabrication and three-dimensional printing.

Collaborations

Niesler collaborates with notable colleagues, including Michael Thiel and Roman Reinhard Reiner. Their combined expertise contributes to the advancement of technologies in their field.

Conclusion

Fabian Niesler's innovative methods for producing three-dimensional structures represent a significant advancement in lithographic technology. His contributions continue to influence the future of microfabrication and related industries.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…