Vancouver, WA, United States of America

Eva Brown

This inventor holds 1 USPTO granted patent. Top assignee: Seh America, Inc.. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eva Brown. Retrieved from https://idiyas.com/inventor/eva-brown-58wg0099

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Eva Brown: Innovator in Wafer Monitoring Technology

Introduction: Eva Brown is a prominent inventor based in Vancouver, WA (US). She has made significant contributions to the field of semiconductor technology, particularly in the area of wafer monitoring systems. Her innovative approach has led to the development of a unique method for measuring and monitoring defects in wafers.

Latest Patents: Eva holds 1 patent for her invention titled "Back Side Damage Monitoring System." This patent describes a method of measuring and monitoring the back side and interior defect density of a wafer. The process involves increasing the back side reflectivity through lapping, etching, and controlled back side damage, followed by measuring defect density with an optical scanner.

Career Highlights: Eva is currently employed at Seh America, Inc., where she continues to advance her research and development efforts. Her work has been instrumental in enhancing the quality and reliability of semiconductor manufacturing processes.

Collaborations: Eva has collaborated with notable colleagues, including Naoto Tate and Michito Sato, who have contributed to her projects and research initiatives.

Conclusion: Eva Brown's innovative contributions to wafer monitoring technology exemplify her dedication to advancing semiconductor manufacturing. Her work not only enhances the industry but also sets a standard for future innovations in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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