Elmira, NY, United States of America

Eunyoung Park

This inventor holds 9 USPTO granted patents and 1 published patent application and 3 EPO patents. Top assignee: Corning Incorporated. Active years: 2011-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eunyoung Park. Retrieved from https://idiyas.com/inventor/eunyoung-park-d4aadg0h

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9 

% Patents Active = 22.2

 

Average Co-Inventor Count = 2.9

ph-index = 5

Forward Citations = 67(Granted Patents)


Company Filing History:


Years Active: 2011-2021

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9 patents (USPTO):Explore Patents

Title: The Innovative Journey of Eunyoung Park

Introduction

Eunyoung Park, an accomplished inventor based in Elmira, NY, has made significant contributions to the field of electronic device technology. With nine patents to her name, she continues to push the boundaries of innovation, particularly in the realm of bendable electronic devices.

Latest Patents

Among Eunyoung's notable inventions are her recent patents focused on bendable electronic device modules. These patents describe a foldable electronic device module featuring a glass cover element with precise specifications: a thickness ranging from about 25 micrometers to about 200 micrometers and an elastic modulus between approximately 20 GPa and 140 GPa. The innovative module also includes a complex stack with a thickness between about 50 micrometers and 600 micrometers, enhanced by a first adhesive that joins the stack to the cover element. This adhesive possesses a shear modulus between about 0.01 MPa and 1 GPa, with a glass transition temperature no lower than 80°C. Additionally, her designs incorporate a unique flex-bond residual stress region, which ensures durability and performance during bending.

Another patent introduces a bendable electronic device module characterized by a glass cover element that maintains puncture resistance of at least 1.5 kgf while adhering to strict thickness and modulus requirements. Eunyoung's approach to minimizing tangential stress during bending enhances the overall performance and reliability of these innovative devices.

Career Highlights

Eunyoung Park's career is marked by her tenure at Corning Incorporated, a leading company in glass and ceramics. Her expertise in material science and engineering has enabled her to work on groundbreaking technologies that advance the way flexible electronic devices are manufactured and used.

Collaborations

Throughout her career, Eunyoung has collaborated with talented individuals such as Kenneth William Aniolek and Guangli Hu. These partnerships have not only enriched her work but also contributed to a collaborative culture at Corning Incorporated, fostering an environment where innovative ideas can thrive.

Conclusion

Eunyoung Park is a prominent figure in the field of electronic device innovation. Her contributions, including her latest patented technologies, illustrate her profound impact on the industry. As she continues her work at Corning Incorporated, the future of bendable electronic devices looks promising, thanks to the groundbreaking inventions of Eunyoung Park.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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