Corning Incorporated

Eunyoung Park

Guangli Hu

Yousef Kayed Qaroush

Dhananjay Joshi

Kenneth William Aniolek

Steven Roy Burdette

Liam Ruan De Paor

Thomas Dale Ketcham

Douglas Clippinger Allan

Kiat Chyai Kang

Steven Michael Milillo

Nikolay Anatolyevich Panin

Adam Charles Berkey

Joseph James McIntosh

Joseph J Mcintosh

A foldable electronic device module that includes a glass cover element having a thickness from about 25 &#x3bc;m to about 200 &#x3bc;m, an elastic modulus from about 20 GPa to about 140 GPa. The module further includes: a stack having a thickness from about 50 &#x3bc;m to about 600 &#x3bc;m; and a first adhesive joining the stack to a second primary surface of the cover element, the adhesive having a shear modulus from about 0.01 MPa to about 1 GPa and a glass transition temperature of at least 80 C. Further, the device module includes a flex-bond residual stress region through the thickness, and within a central region, of the cover element that ranges from a maximum compressive residual stress at the second primary surface to a maximum tensile residual stress at a first primary surface of the element along a central bend axis of the cover element.

Bendable electronic device modules, articles and bonding methods of making the same

A foldable electronic device module includes a glass cover element having a thickness from about 25 &#x3bc;m to about 200 &#x3bc;m, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 &#x3bc;m and about 600 &#x3bc;m; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.

Bendable electronic device modules, articles and methods of making the same

Isopipes () for making a glass or a glass-ceramic using a fusion process are provided. The isopipes are made from an alumina material which has a higher static fatigue than existing alumina materials intended for use as isopipes. In particular, the alumina materials have times-to-failure (static fatigues) of greater than one hour at 1200&#xb0; C. at an applied stress of 10,000 psi. These high levels of static fatigue allow alumina isopipes to replace zircon isopipes in the manufacture of high performance glass sheets by the fusion process, including glass sheets which are incompatible with zircon isopipes but compatible with alumina isopipes, e.g., chip and scratch resistant glass sheets which have high alkali contents.

High static fatigue alumina isopipes

The invention is directed to a method of preventing isopipe sag when using the overflow drawdown fusion process for making flat glass sheets. The method applies a vertical restraint on at least one end of an isopipe resting on a support to thereby reduce sage and/or the rate of sag during use of the isopipe. Using the vertical restraint block in accordance with the invention, the sag and/or rate of sag has been found to be reduced by at least 40 percent relative to an isopipe that does not use the vertical restraints of the invention or a compressive force along the sides of the isopipe.

Isopipe sag control using improved end support conditions

A method and apparatus for forming a glass sheet using a fusion down-draw process, wherein the heating powers of the heating elements are managed such that in case of a failure of one heating element, the heating power of the adjacent heating element is immediately increased. The method decreases the thermal stress the forming body is exposed to due to the failure of the heating element.

Method and apparatus for making a glass sheet with controlled heating

Methods and apparatus for controlling the stress in, and the shape of, the glass ribbon () formed in a downdraw glass manufacturing process (e.g., the fusion downdraw process) are provided. In certain embodiments, the control is achieved by cooling the bead portions () of the ribbon () at a rate which provides a heat flux Q&#x2033;at the thickest part of the bead () which is given by Q&#x2033;=Q&#x2033;+&#x394;Q&#x2033;, where (i) Q&#x2033;is the heat flux at a transverse position adjacent to the bead portion () at which the ribbon's thickness equals 1.05*t, where tis the final thickness at the ribbon's center line (), and (ii) &#x394;Q&#x2033;&#x2267;(t/t&#x2212;1)Q&#x2033;+10 kilowatts/meter, where tis the thickness of the thickest part of the bead portion. The cooling can take place along the entire length of the ribbon () or at selected locations, e.g., in the portion () of the draw which includes the glass transition temperature region () or the portion () of the draw where individual glass sheets () are cut from the ribbon ().

Thermal control of the bead portion of a glass ribbon

In a method of making a glass sheet using an overflow fusion downdraw process, a glass sheet quality metric level Qis selected, where Qis a measure of allowable retardation in the glass sheet. A glass ribbon temperature Tat which a potential glass ribbon thermal artifact could occur in a glass ribbon while the glass ribbon is being drawn through a drawing machine enclosure is identified. A thermal artifact envelope Eis determined, where Econtains types of glass ribbon thermal artifacts allowable at Tand Q. A glass melt is overflowed from an isopipe to form a glass ribbon at the root of the isopipe. The glass ribbon is drawn below the root of the isopipe through the drawing machine enclosure to form the glass sheet. The drawing machine enclosure is altered at a location corresponding to where the glass ribbon would be at Tsuch that during drawing of the glass ribbon the potential glass ribbon thermal artifact is not formed in the glass ribbon at Tor, if the potential glass ribbon thermal artifact is formed in the glass ribbon at T, the potential glass ribbon thermal artifact is within E.

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Elmira, NY, United States of America

Eunyoung Park