Augsburg, Germany

Eugen Unger


Average Co-Inventor Count = 2.7

ph-index = 3

Forward Citations = 49(Granted Patents)


Location History:

  • Munich, DE (2010)
  • Augsburg, DE (2004 - 2012)

Company Filing History:


Years Active: 2004-2012

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8 patents (USPTO):

Title: Eugen Unger: Innovator in Carbon Layer Deposition Technologies

Introduction

Eugen Unger is a notable inventor based in Augsburg, Germany. He has made significant contributions to the field of materials science, particularly in the deposition of carbon-containing layers. With a total of 8 patents to his name, Unger has developed innovative methods that enhance the performance and efficiency of electronic components.

Latest Patents

Unger’s latest patents include groundbreaking methods for the elimination or reduction of oxide and soot deposition in carbon-containing layers. One embodiment of his invention provides a method for depositing a carbon-containing layer on a silicon surface, ensuring a substantially silicon-oxide-free interface during the deposition process. Another embodiment focuses on achieving a soot-free deposition process, which is crucial for maintaining the integrity of the carbon layer. Additionally, he has developed a method for manufacturing a layer arrangement that involves embedding electrically conductive structures within a substrate, enhancing the functionality of electronic devices.

Career Highlights

Throughout his career, Unger has worked with prominent companies in the technology sector, including Infineon Technologies AG and Qimonda AG. His work has significantly impacted the development of advanced materials used in electronics, contributing to the evolution of semiconductor technologies.

Collaborations

Unger has collaborated with several professionals in his field, including Maik Liebau and Georg Stefan Dusberg. These collaborations have fostered innovation and have led to the successful development of his patented technologies.

Conclusion

Eugen Unger stands out as a key figure in the advancement of carbon layer deposition technologies. His innovative methods and collaborations have paved the way for significant improvements in electronic component manufacturing.

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