This inventor holds 1 USPTO granted patent. Top assignee: Technion Research & Development Foundation Ltd. Active years: 2011.
Company Filing History:
Years Active: 2011
Title: Esta Abelev: Innovator in Copper CMP Slurry Composition
Introduction
Esta Abelev is a notable inventor based in Kiryat-Yam, Israel. She has made significant contributions to the field of chemical-mechanical planarization (CMP) through her innovative patent. Her work focuses on enhancing the efficiency and effectiveness of copper-containing surfaces in various applications.
Latest Patents
Esta Abelev holds a patent for a Copper CMP slurry composition. This composition rapidly passivates copper-containing surfaces to yield a uniform layer of insoluble copper oxide. The solution has a pH of equal to or greater than 9 and possesses an oxidation potential sufficient to oxidize the surface, forming non-soluble copper oxides. The patent also details methods for making and using this composition, showcasing her expertise in the field.
Career Highlights
Esta is associated with the Technion Research & Development Foundation Ltd., where she continues to advance her research and development efforts. Her work has garnered attention for its practical applications in the semiconductor industry, particularly in improving the quality of copper surfaces.
Collaborations
Esta collaborates with esteemed colleagues such as Yair Ein-Eli and David Starosvetsky. Their combined expertise contributes to the innovative research and development initiatives at Technion.
Conclusion
Esta Abelev's contributions to the field of CMP slurry compositions highlight her role as a leading inventor in the industry. Her innovative solutions are paving the way for advancements in the treatment of copper-containing surfaces.