Thousand Oaks, CA, United States of America

Ershad Ali

This inventor holds 1 USPTO granted patent. Top assignee: Marvell Asia Pte., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ershad Ali. Retrieved from https://idiyas.com/inventor/ershad-ali

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Ershad Ali - Innovator in Semiconductor Technology

Introduction

Ershad Ali is a notable inventor based in Thousand Oaks, CA (US). He has made significant contributions to the field of semiconductor technology, particularly with his innovative designs that enhance device performance and reliability.

Latest Patents

Ershad holds a patent for a semiconductor device package with a semiconductive thermal pedestal. This invention includes a semiconductor die enclosed in packaging material, featuring a plurality of contacts on its exterior surface. The design incorporates a pedestal made of semiconductor material that is thermally conductive and electrically non-conductive, providing essential electromagnetic shielding for the semiconductor die.

Career Highlights

Ershad Ali is currently employed at Marvell Asia Pte., Ltd., where he continues to push the boundaries of semiconductor technology. His work focuses on developing advanced packaging solutions that improve thermal management and device efficiency.

Collaborations

Throughout his career, Ershad has collaborated with talented professionals, including Han Gao and Shrinath Ramdas. These partnerships have fostered innovation and contributed to the success of their projects.

Conclusion

Ershad Ali's contributions to semiconductor technology exemplify the impact of innovative thinking in the industry. His patent and ongoing work at Marvell Asia Pte., Ltd. highlight his commitment to advancing technology for better performance and reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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