Marvell Asia Pte., Ltd.

Ershad Ali

Roberto Coccioli

Dwayne Richard Shirley

Han Gao

Shrinath Ramdas

A semiconductor device package includes a semiconductor die having two largest dimensions that define a major plane, a packaging material enclosing the semiconductor die, a plurality of contacts on a first exterior surface of the semiconductor device package that is parallel to the major plane, the first exterior surface defining a bottom of the semiconductor device package, and a pedestal of semiconductor material above the semiconductor die in a thermally-conductive, electrically non-conductive relationship with the semiconductor die. The semiconductor material of the pedestal may be doped to provide electromagnetic shielding of the semiconductor die.

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Thousand Oaks, CA, United States of America

Ershad Ali