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For the Inventor, By the Inventor

Raleigh, NC, United States of America

Erik Paul Vick

This inventor holds 13 USPTO granted patents and 3 published patent applications, primarily in Electronic Packaging. Top assignees: X Display Company Technology Limited, Research Triangle Institute, Daktronics, Inc.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Erik Paul Vick. Retrieved from https://idiyas.com/inventor/erik-paul-vick

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 13 

% Patents Active = 76.9

Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 49(Granted Patents)


Company Filing History:

goldMedal6 out of 124 
 
X Display Company Technology Limited
 patents
silverMedal4 out of 361 
 
Research Triangle Institute
 patents
bronzeMedal1 out of 123 
 
Daktronics, Inc.
 patents
4. 1 out of 2 
 
Display Company Technology Limited
 patents
5. 1 out of 5 
 
Micross Advanced Interconnect Technology LLC
 patents

Years Active: 2013-2026

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Areas of Expertise:
Laser-formed Interconnects
Redundant Devices
Pixel Layouts
Integrated Circuits
Electronic Packages
Three-dimensional Conductive Planes
Flexible Assemblies
Embedded Devices
Die Bonding
Contact Pads
Fabrication Methods
Modules
13 patents (USPTO):Explore Patents
1. 12628643 - Laser-formed interconnects for redundant devices (2026-05-12),
2. 12482799 - Modules with integrated circuits and devices (2025-11-25),
3. 12236825 - Redundant pixel layouts (2025-02-25),
4. 11881475 - Modules with integrated circuits and devices (2024-01-23),
5. 11804431 - Laser-formed interconnects for redundant devices (2023-10-31),
6. 11488943 - Modules with integrated circuits and devices (2022-11-01),
7. 11282786 - Laser-formed interconnects for redundant devices (2022-03-22),
8. 10944027 - Pixel modules with controllers and light emitters (2021-03-09),
9. 10418344 - Electronic packages with three-dimensional conductive planes, and methods for fabrication (2019-09-17),
10. 10264669 - Flexible electronic assemblies with embedded electronic devices and methods for their fabrication (2019-04-16),
11. 9576889 - Three-dimensional electronic packages utilizing unpatterned adhesive layer (2017-02-21),
12. 9257335 - Electronic devices utilizing contact pads with protrusions and methods for fabrication (2016-02-09),
13. 8361901 - Die bonding utilizing a patterned adhesion layer (2013-01-29),

Title: Innovating the Future: The Inventor Erik Paul Vick

Introduction: Erik Paul Vick, a visionary inventor based in Raleigh, NC (US), has made significant contributions to the field of technology with his impressive portfolio of 10 patents.

Latest Patents: Among his latest patents is the groundbreaking innovation of Modules with integrated circuits and devices. This technology revolutionizes pixel modules and wafer structures, enhancing display capabilities with advanced features. Additionally, his work on Laser-formed interconnects for redundant devices showcases his expertise in creating parallel redundant systems for improved circuit efficiency.

Career Highlights: Erik Paul Vick has lent his inventive skills to renowned companies such as X Display Company Technology Limited and Research Triangle Institute, where he has played a key role in driving technological advancements.

Collaborations: Throughout his career, Erik Paul Vick has collaborated with talented individuals such as Ronald S Cok and Matthew Alexander Meitl, collectively pushing the boundaries of innovation and setting new industry standards.

Conclusion: Erik Paul Vick's remarkable journey as an inventor underscores his commitment to driving technological progress and shaping the future of innovation. His relentless pursuit of excellence continues to inspire and pave the way for groundbreaking inventions in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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