The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Jan. 26, 2018
Applicant:
Micross Advanced Interconnect Technology Llc, Research Triangle Park, NC (US);
Inventors:
Erik Paul Vick, Raleigh, NC (US);
Dorota Temple, Cary, NC (US);
Assignee:
Micross Advanced Interconnect Technology LLC, Research Triangle Park, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/481 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/92 (2013.01); H01L 25/50 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/25 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/244 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/2511 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06544 (2013.01); H01L 2225/06565 (2013.01);
Abstract
An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.