This inventor holds 1 USPTO granted patent. Top assignee: Northrop Grumman Systems Corporation. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: Eric V Miller: Innovator in Radio Frequency Technology
Introduction
Eric V Miller is a notable inventor based in Phoenix, MD (US). He has made significant contributions to the field of radio frequency technology, particularly in the development of advanced transmit/receive modules. His work is characterized by innovation and a commitment to enhancing communication systems.
Latest Patents
Eric V Miller holds a patent for a "Dual band quadpack transmit/receive module." This invention is a multi-channel, dual-band radio frequency (RF) transmit/receive (T/R) module designed for active electronically scanned arrays. The module features a compact RF manifold connector and includes at least four T/R channels. Each channel is equipped with a notch radiator, a diplexer, a power amplifier with dual-band gain stages, a low noise amplifier with both lower-band and upper-band gain stages, and a T/R cell that incorporates a phase shifter and signal attenuator.
Career Highlights
Eric is currently employed at Northrop Grumman Systems Corporation, where he continues to push the boundaries of RF technology. His work at Northrop Grumman has positioned him as a key player in the development of advanced communication systems.
Collaborations
Throughout his career, Eric has collaborated with talented individuals such as Harry V Guy, III and Brian T McMonagle. These collaborations have fostered an environment of innovation and creativity, leading to the successful development of cutting-edge technologies.
Conclusion
Eric V Miller's contributions to the field of radio frequency technology exemplify his dedication to innovation and excellence. His patent for the dual band quadpack transmit/receive module showcases his ability to create advanced solutions for modern communication challenges.