Northrop Grumman Systems Corporation

Eric V Miller

Ronald G Freitag

John W Gipprich

Tapan K Gupta

Cynthia W Berry

Mike L Salib

Joseph A Faulkner

Vincent G Karasack

Brian T McMonagle

Michael J Lee

Benjamin R Myers

Gene A Digennaro

Harry V Guy, Iii

Eric D Zirofsky

Dave M Krafcsik

Robert B Middleton

Kerron R Duncan

John P Vitamvas

Thomas M Walsh

A multi-channel, dual-band, radio frequency (RF) transmit/receive (T/R) module, for an active electronically scanned array, is provided. The module includes a compact, RF manifold connector and at least four T/R channels. Each of the T/R channels includes a notch radiator, a diplexer coupled to the notch radiator, a power amplifier, including at least one dual-band gain stage, coupled to the notch radiator, a low noise amplifier, including at least one lower-band gain stage and at least one upper-band gain stage, coupled to the diplexer, and a T/R cell, including a phase shifter, a signal attenuator and at least one dual-band gain stage, coupled to the power amplifier, the low noise amplifier and the manifold connector.

Dual band quadpack transmit/receive module

Growing community of inventors

Phoenix, MD, United States of America

Eric V Miller