Eric Munro Innes

This inventor holds 14 USPTO granted patents and 4 published patent applications and 2 EPO patents. Top assignees: 3D Systems, Inc., Oracle International Corporation, Hewlett-Packard Development Company, L.p.. Active years: 2012-2026.

USPTO Granted Patents = 14 (Patent Applications = 4)

% Patents Active = 92.9

EPO Patents = 2 (Patent Applications = 4)

Average Co-Inventor Count = 1.4

ph-index = 2

Forward Citations = 10(Granted Patents)

Company Filing History:

Oracle International Corporation

patents

2 out of 27,658

Hewlett-Packard Development Company, L.p.

patents

Years Active: 2012-2026

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12617153 - Three-dimensional printing system with resin vessel positioning system (2026-05-05),

2. 12128633 - Stereolithography system for accurately establishing build plane (2024-10-29),

3. 11919230 - Three-dimensional printing system throughput improvement by sensing volume compensator motion (2024-03-05),

4. 11738518 - Stereolithography system for accurately establishing build plane (2023-08-29),

5. 11225020 - Three-dimensional printing system with sloped build plane (2022-01-18),

6. 11090868 - Three-dimensional printing system with recirculating air handling system (2021-08-17),

7. 10890219 - Integrated fan braking mechanism (2021-01-12),

8. 10080304 - Functional electromagnetic interference containment assembly for plugging enclosure openings (2018-09-18),

9. 10051758 - Chassis with low-cost, tool-less fastening mechanisms for rack mount systems (2018-08-14),

10. 9965001 - Mounting assembly for tool-less mounting of a circuit board in an enclosure (2018-05-08),

11. 9826655 - Method and apparatus for mounting a circuit board in an enclosure (2017-11-21),

12. 9763351 - Low cost card carrier for vertical insertion of a computer card in an enclosure (2017-09-12),

13. 8894064 - Inkjet printer accessory (2014-11-25),

14. 8303101 - Apparatus for printing on a medium (2012-11-06),

Title: Eric Munro Innes: Innovator in 3D Printing Technology

Introduction

Eric Munro Innes is a prominent inventor based in San Diego, California, known for his significant contributions to the field of three-dimensional (3D) printing technology. With a total of 13 patents to his name, Innes has developed innovative systems that enhance the accuracy and efficiency of 3D printing processes.

Latest Patents

Among his latest patents is a stereolithography system designed for accurately establishing a build plane. This advanced 3D printing system includes a vessel that contains a photocurable resin, a coating subsystem, a calibration block, and a controller. The system is engineered to ensure precise positioning of the coater blade over the calibration block, allowing for accurate measurements and improved print quality.

Another notable patent focuses on improving the throughput of 3D printing systems by sensing volume compensator motion. This invention incorporates a resin vessel, an imaging system, a build plate, and a controller that operates to maintain the resin upper surface close to the build plane. The controller analyzes signals related to the vertical motion of the resin surface, ensuring optimal conditions for generating base layers and ultimately producing high-quality 3D articles.

Career Highlights

Innes has worked with several notable companies throughout his career, including Oracle International Corporation and 3D Systems, Inc. His experience in these organizations has contributed to his expertise in developing cutting-edge 3D printing technologies.

Collaborations

Throughout his career, Innes has collaborated with talented individuals such as Andres Gabriel Hofmann and Rebecca Di Ricco Kurzava. These partnerships have fostered innovation and creativity in the projects he has undertaken.

Conclusion

Eric Munro Innes is a distinguished inventor whose work in 3D printing technology has made a significant impact on the industry. His innovative patents and collaborations reflect his commitment to advancing the field and enhancing the capabilities of 3D printing systems.