Torrance, CA, United States of America

Eric Maye


Average Co-Inventor Count = 5.3

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2017-2019

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3 patents (USPTO):Explore Patents

Title: Eric Maye: Innovator in Material Analysis

Introduction

Eric Maye is a prominent inventor based in Torrance, California. He has made significant contributions to the field of material analysis, holding a total of 3 patents. His work focuses on the identification and analysis of materials and molecular structures, showcasing his expertise in advanced technologies.

Latest Patents

One of Eric Maye's latest patents involves methods and systems for the identification and analysis of materials and molecular structures. This innovative apparatus includes a laser, which features an amplified spontaneous emission-suppressed single-frequency laser excitation source. The design incorporates a plurality of filters, including reflective volume holographic grating blocking filters. Additionally, the apparatus comprises an optical unit and an optical spectrometer. The optical unit is configured to deliver excitation energy to a sample substance and capture Raman signal scattering from that substance. The optical spectrometer is strategically placed in the path of the Raman signal to measure its spectrum and generate a detection signal. Finally, a processing unit is included to analyze the spectrum, enhancing the capabilities of material analysis.

Career Highlights

Eric Maye is currently employed at Ondax, Inc., where he continues to develop innovative solutions in his field. His work has positioned him as a key figure in the advancement of material analysis technologies.

Collaborations

Some of Eric's notable coworkers include James Carriere and Lawrence Ho, who contribute to the collaborative environment at Ondax, Inc.

Conclusion

Eric Maye's contributions to the field of material analysis through his patents and work at Ondax, Inc. highlight his role as an influential inventor. His innovative approaches continue to push the boundaries of technology in this important area.

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