Company Filing History:
8 out of 210 
7 out of 7 
5 out of 6 
Years Active: 1988-2025
Title: Inventor Eric Frank Schulte: Pioneering Low-Temperature Bonding Technologies
Introduction
Eric Frank Schulte, based in Santa Barbara, California, is a distinguished inventor with 22 patents to his name. His innovative work primarily focuses on methods and systems for low-force, low-temperature thermocompression bonding, significantly contributing to advancements in three-dimensional integrated circuit technology.
Latest Patents
Among his latest patents, Schulte has developed techniques for thermocompression bonding using passivated copper-based contacting metal. His innovations provide reliable bonding while utilizing cold thermocompression methods. This process incorporates reduction and passivation steps to minimize native oxide formation on contact metals, effectively utilizing atmospheric plasma treatments. By ensuring that the physical compression height is just sufficient to generate compression of bonding element pairs, the method compensates for any lack of flatness. Notably, his bonding techniques operate well below the melting point, preventing deformation of underlying layers and fostering efficient regulation of thermocompression resistance.
Another significant patent focuses on thermocompression bonding utilizing metastable gas atoms. This reflects his ongoing commitment to enhancing the reliability and efficiency of bonding technologies critical for integrated circuits.
Career Highlights
Eric Frank Schulte has made impactful contributions through his roles at notable companies, including Santa Barbara Research Center and Ontos Equipment Systems, Inc. His expertise in the field of thermocompression bonding has been pivotal in shaping modern methodologies used in semiconductor manufacturing and integrated circuit development.
Collaborations
Throughout his career, Schulte has collaborated with talented individuals, including Charles A. Cockrum and Justin K. Markunas. These partnerships have further enriched his inventive endeavors and fostered a collaborative spirit within the realm of technological advancement.
Conclusion
Eric Frank Schulte's remarkable contributions to low-temperature bonding methods demonstrate a forward-thinking approach to innovation in integrated circuits. His continued advancements secure his legacy as a leading inventor in the realm of thermocompression bonding, promising enhanced technologies for the future.