Eric Douglas Springston, Ii

Title: The Innovative Contributions of Eric Douglas Springston, II

Introduction

Eric Douglas Springston, II is a notable inventor based in Hershey, PA (US). He has made significant contributions to the field of electrical engineering, particularly in the development of modular connectors and RF modules. With a total of 6 patents to his name, Springston's work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is for a modular connector with a printed circuit board wafer designed to reduce crosstalk. This innovative circuit board features a first surface and an oppositely facing second surface, with signal pathways provided on the first surface. The design includes first ground pathways adjacent to the signal pathways, which help minimize crosstalk between signal pairs. Another significant patent is for an RF connector for an RF module. This RF module includes a housing with connector cavities and a rear wall with lands adjacent to openings. The RF connector is designed to float within the connector cavity, allowing for enhanced functionality and reliability.

Career Highlights

Throughout his career, Springston has worked with prominent companies such as Tyco Electronics Corporation and Te Connectivity Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Springston has collaborated with talented individuals in the field, including Keith Edwin Miller and Kyle Gary Annis. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Eric Douglas Springston, II is a distinguished inventor whose work in modular connectors and RF modules has advanced the field of electrical engineering. His patents reflect a commitment to innovation and excellence, making him a valuable contributor to the industry.