Company Filing History:
Years Active: 2012
Title: Inventor Spotlight: Eric C E Van Grunsven
Introduction: Eric C E Van Grunsven is a notable inventor based in Someren, Netherlands. With a focus on advancements in integrated circuits, he has made significant contributions to the field of electronics. His inventive work has resulted in the grant of at least one patent, showcasing his expertise in this technical domain.
Latest Patents: Eric's most recognized patent is titled "Method of manufacturing an integrated circuit." This innovative patent describes an integrated circuit that features a silicon substrate and an interconnect that extends through a hole, linking the first and second sides of the substrate. The interconnect is associated with a metallization layer located on the first side of the substrate and rests on an amorphous silicon layer along the side wall of the through-hole. Notably, this interconnect utilizes a metal stack composed of nickel and silver, and the amorphous silicon layer is notably formed using a sputter etching technique.
Career Highlights: Eric is associated with NXP B.V., a company renowned for its innovations in semiconductor technology. His work at NXP highlights his involvement in pushing the boundaries of integrated circuit design and production, solidifying his role in the tech industry.
Collaborations: Throughout his career, Eric has collaborated with notable colleagues such as Stephane Morel and Arnoldus Den Dekker. These collaborations showcase a team-oriented approach to innovation, bringing together diverse expertise to enhance the development of advanced technologies.
Conclusion: Eric C E Van Grunsven exemplifies the innovative spirit present in the semiconductor industry. His contributions, particularly through his patented method for manufacturing an integrated circuit, demonstrate both technical proficiency and a commitment to advancing electronic solutions. As technologies continue to evolve, the impact of inventors like Eric will undoubtedly play a critical role in shaping the future of electronics.