This inventor holds 4 USPTO granted patents and 2 published patent applications. Top assignee: Mitsubishi Chemical Corporation. Active years: 2019-2026.
Location History:
- Chiyoda-ku, JP (2019)
- Tokyo, JP (2022 - 2024)
Company Filing History:
Years Active: 2019-2026
Title: Eri Masuda: Innovator in Epoxy Resin Technology
Introduction
Eri Masuda is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of epoxy resin technology, holding a total of 4 patents. Her work focuses on developing advanced materials that enhance the performance and application of adhesives and molding materials.
Latest Patents
Masuda's latest patents include innovative formulations such as a macromonomer copolymer epoxy resin composition. This composition comprises a (meth)acrylic copolymer (A), an epoxy resin (B), and a curing agent (C). The copolymer (A) features a constituent unit derived from a macromonomer and a vinyl monomer, with a glass transition temperature (TgB) of 25° C. or less. Another notable patent is her adhesive resin composition, which is designed to create an adhesive layer with excellent holding force, wet heat clouding resistance, and low corrosiveness. This composition also includes a (meth)acrylic copolymer (A) with specific structural features.
Career Highlights
Eri Masuda is currently employed at Mitsubishi Chemical Corporation, where she continues to innovate in the field of polymer chemistry. Her work has been instrumental in advancing the capabilities of adhesive materials, making them more effective for various applications.
Collaborations
Masuda collaborates with esteemed colleagues such as Junichi Nakamura and Kazuyoshi Odaka. Their combined expertise contributes to the development of cutting-edge technologies in the chemical industry.
Conclusion
Eri Masuda's contributions to epoxy resin technology and adhesive materials highlight her role as a leading inventor in her field. Her innovative patents and collaborations reflect her commitment to advancing material science.