Mitsubishi Chemical Corporation

Eri Masuda

Junichi Nakamura

Hiroko Shinada

Kazuyoshi Odaka

Takayuki Kobayashi

Go Otani

Sora Tomita

There is provided an epoxy resin composition comprising a (meth)acrylic copolymer (A), an epoxy resin (B), and a curing agent (C), wherein the (meth)acrylic copolymer (A) has a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), and wherein a glass transition temperature (TgB) of a polymer obtained by polymerizing only the vinyl monomer (b) is 25° C. or less.

Macromonomer copolymer, epoxy resin composition, adhesive, molding material, and cured product

Provided are an adhesive resin composition capable of forming an adhesive layer excellent in holding force, wet heat clouding resistance, and low corrosiveness; and an adhesive sheet. The adhesive resin composition includes a (meth)acrylic copolymer (A) having a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), in which the (meth)acrylic copolymer (A) has at least one of an amide bond and a radical polymerizable group.

Adhesive resin composition and adhesive sheet

A (meth)acrylic acid copolymer (A) having a weight average molecular weight of 1000 to 1,000,000, and in which when the half-width of the primary scatter peak when measured by small angle X-ray scattering is defined as X, 0.12&#x3c;X, is used as an adhesive. The (meth)acrylic copolymer (A) is obtained by polymerizing a monomer mixture containing a macromonomer (a) having a number average molecular weight of 500-100,000, and a vinyl monomer (b). The adhesive has sufficient holding force and adhesive force, and the occurrence of adhesive deposit can be prevented when peeled off.

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Eri Masuda