Enrique C Abreu

Title: Innovations by Inventor Enrique C Abreu

Introduction

Enrique C Abreu is a notable inventor based in Wappingers Falls, NY (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent that enhances module assembly processes.

Latest Patents

Abreu holds a patent for a "Process and apparatus for improved module assembly using shape memory alloy springs." This invention involves a fixture and process designed for the assembly of semiconductor modules. Each module consists of a substrate and a cover attached to it. The fixture includes a baseplate that accepts the substrate and a spring-loading device that contains a shape memory alloy spring engaging the cover. The unique feature of this spring is that it exerts a lesser force at room temperature and an elevated force at the bonding temperature of the adhesive used to attach the cover to the substrate. The process involves several steps: loading the module into an assembly fixture, aligning the spring over the module at room temperature, heating the fixture and module to a bonding temperature, and finally cooling the assembly to disengage the springs.

Career Highlights

Enrique C Abreu is associated with International Business Machines Corporation (IBM), where he has contributed to advancements in semiconductor technology. His work has been instrumental in improving the efficiency and effectiveness of module assembly processes.

Collaborations

Throughout his career, Abreu has collaborated with notable colleagues, including David L Edwards and Ronald L Hering. These collaborations have further enriched his contributions to the field.

Conclusion

Enrique C Abreu's innovative work in semiconductor module assembly showcases his expertise and commitment to advancing technology. His patent reflects a significant step forward in the efficiency of assembly processes, highlighting his role as a key inventor in this domain.