The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Feb. 16, 1999
David L. Edwards, Poughkeepsie, NY (US);
Enrique C. Abreu, Wappingers Falls, NY (US);
Ronald L. Hering, Pleasant Valley, NY (US);
David C. Olson, LaGrangeville, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate. The process comprises the steps of (a) loading she module into an assembly fixture and aligning a shape memory alloy spring over the module at room temperature; (b) placing the fixture and module into a heating chamber; (c) heating the fixture and module to a temperature sufficient for bonding and above the shape memory alloy spring transition temperature range so that the spring exerts an elevated force on the module; and (d) cooping the fixture and module below the transition temperature so that the spring exerts a lesser amount of force on the module, and disengaging the springs at the lower temperature.