This inventor holds 1 USPTO granted patent. Top assignee: Siltronic Ag. Active years: 2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019
Title: Engelbert Auer: Innovator in Wire Saw Technology
Introduction
Engelbert Auer is a notable inventor based in Burgkirchen, Germany. He has made significant contributions to the field of wire saw technology, particularly with his innovative designs that enhance the efficiency of wafer slicing.
Latest Patents
Auer holds a patent for a wire guide roll specifically designed for wire saws. This invention allows for the simultaneous slicing of multiple wafers from a cylindrical workpiece. The wire guide roll features a coating with a thickness ranging from 2 mm to 7.5 mm, made from a material with a Shore A hardness between 60 and 99. The design includes numerous grooves that guide the sawing wire, each with a curved groove base and a specific radius of curvature, optimizing the slicing process.
Career Highlights
Engelbert Auer is associated with Siltronic AG, a leading company in the semiconductor industry. His work has contributed to advancements in manufacturing processes, particularly in the production of silicon wafers.
Collaborations
Auer has collaborated with notable colleagues such as Anton Huber and Manfred Schoenhofer, who have also played significant roles in the development of innovative technologies within the company.
Conclusion
Engelbert Auer's contributions to wire saw technology exemplify the impact of innovation in the semiconductor industry. His patent for the wire guide roll showcases his commitment to enhancing manufacturing efficiency and precision.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile