The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Apr. 21, 2008
Applicants:

Anton Huber, Bughausen, DE;

Engelbert Auer, Burgkirchen, DE;

Manfred Schoenhofer, Julbach, DE;

Helmut Seehofer, Burghausen, DE;

Peter Wiesner, Reut, DE;

Inventors:

Anton Huber, Bughausen, DE;

Engelbert Auer, Burgkirchen, DE;

Manfred Schoenhofer, Julbach, DE;

Helmut Seehofer, Burghausen, DE;

Peter Wiesner, Reut, DE;

Assignee:

Siltronic AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23D 57/00 (2006.01); B23D 61/18 (2006.01); B24B 27/06 (2006.01); B28D 5/04 (2006.01); B65H 57/14 (2006.01);
U.S. Cl.
CPC ...
B23D 57/0053 (2013.01); B23D 61/18 (2013.01); B24B 27/0633 (2013.01); B28D 5/045 (2013.01); B65H 57/14 (2013.01); Y10T 83/696 (2015.04); Y10T 83/9292 (2015.04);
Abstract

A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130°. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by a wire saw using such wire guide rolls.


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